BE Semiconductor Industries N.V. is a Dutch multinational company specializing in the development, manufacturing, marketing, sales, and service of semiconductor assembly equipment for the global semic... BE Semiconductor Industries N.V. is a Dutch multinational company specializing in the development, manufacturing, marketing, sales, and service of semiconductor assembly equipment for the global semiconductor and electronics industries. Headquartered in Duiven, the Netherlands, it operates through three key segments: Die Attach, Packaging, and Plating, offering advanced solutions like single chip and multi-chip die bonding systems, flip chip equipment, epoxy and soft solder bonding, wafer level molding, trim and form systems, as well as tin, copper, and precious metal plating systems with related chemicals. The company's portfolio, under brands such as Datacon, Esec, Fico, and Meco, supports leadframe, substrate, and wafer level packaging for diverse end-user markets including electronics, mobile internet, cloud computing, automotive, industrial applications, LED, and solar energy. BE Semiconductor Industries N.V. serves leading multinational chip manufacturers, assembly subcontractors, and electronics firms, with production facilities in Asia and development primarily in Europe. Incorporated in 1995, it maintains a global presence through eight facilities and 13 sales offices across Europe, Asia, and North America, employing around 1,870 people as of late 2023. Its equipment ensures high accuracy and performs critical functions in customers' assembly operations.
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